8-layer rigid-flex board
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8-layer rigid-flex board

Product type:8-layer rigid-flex board
Material:FR-4+PI
Layers/plate thickness:Hardboard 6-layer、FPC 2-layer/0.4mm+0.8mm
Surface treatment:Shen Jin
Line width/line spacing:3mil/3mil
Applications:communication
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The trend of PCB design is to develop in the direction of thinness and lightness. In addition to high-density circuit board design, there is an important and complex field such as the three-dimensional connection assembly of flex-rigid boards. Rigid-flex board is also called rigid-flex board. With the birth and development of FPC, the new product of rigid-flex circuit board (flex-rigid board) has gradually been widely used in various occasions. Therefore, the flexible and rigid board is a flexible circuit board and a traditional rigid circuit board, which are combined according to the relevant process requirements through many processes to form a circuit board with both FPC characteristics and PCB characteristics. It can be used in some products with special requirements, including a certain flexible area and a certain rigid area, which is of great help to save the internal space of the product, reduce the volume of the finished product, and improve the performance of the product.



The following points should be paid attention to in the design of the rigid-flex board:

The flexible layer is designed to be on the same sheet as possible in the inner layer and in the middle as much as possible

For example, for an 8-layer board, make a single sheet for top/bottom, 2/3, 4/5, 6/7, and a single sheet for each, and the priority of the flexible layer is 4/5>2/3=6/7


10-layer board: T, 2/3, 4/5, 6/7, 8/9, B, the priority of flexible layer selection is 4/5=6/7>2/3=8/9

Due to the limitation of space or bending angle, the design can be designed with the soft area extending into the board to meet the bending radius and space requirements. At this time, the soft and hard gap should be at least 1mm, and the branch spacing between the soft and hard boards is recommended to be greater than 0.8 mm, the gap between the soft board and the hard board and between the hard board and the hard board is greater than 2mm

The length requirement of the soft zone is related to the bending angle and radius.

Consider the 3D structure of the board after bending to avoid mutual interference between device installations (height limit)

The length of the soft area is recommended to be greater than 5mm, and the limit value is 4mm, otherwise it may not be processed

When the device is placed in the rigid area, the distance between the edge of the device and the rigid-flex area is greater than 1mm

The soft area should not be punched as much as possible, and the distance between the hard area and the soft-hard joint is recommended to be greater than 2mm.

The arc transition should be used as far as possible for the soft and hard joint. The radius depends on the actual situation. It is recommended to be 6.35mm, but generally it cannot reach this value. It is recommended to be at least 0.5mm.

The wiring of adjacent layers in the soft area adopts staggered wiring to avoid overlapping wiring as much as possible, so that the softness of the soft area can be uniformly increased and the bending life can be increased.

The wiring in the soft area should be straight in and out as much as possible. If the structure is limited to the combination of soft and hard, try to use arc transitions, and also make arcs at the corners of the soft area.

If the signal across the soft area does not need to control the impedance, and copper needs to be laid in the soft area (power ground signal), it is recommended to lay grid copper

If the signal across the soft area needs to control the impedance, it should be noted that the signal line still needs a reference plane in the soft area, and the impedance line width needs to be calculated separately. It is likely that the line width will suddenly change.

Try not to place the device in the soft area. If the device is installed, the pad should be set to the corresponding soft layer instead of top/bottom when building the library.

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