6-layer BGA package carrier board
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6-layer BGA package carrier board

Product type:6-layer BGA package carrier board
Material:EM-526
Layers/plate thickness:6-layer/0.5mm
Surface treatment:Nickel Palladium Gold
Line width/line spacing:50um-50um
Applications:BGA carrier board, IC substrate, chip carrier board
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제품 세부 정보:

BGA package carrier board features:
High Density Junction Structure
Via Fill Plating and Stacked Via Structures
Various surface treatments
High requirements for sheet and surface flatness

BGA package carrier board using process:
Subtractive method, laser drilling, hole filling

BGA package carrier board application:
Smartphones, Computers, IoT Products, Messaging Electronics


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