LGA package carrier board
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LGA package carrier board

Product type:LGA package carrier board
Material:HL832NXA
Layers/plate thickness:2-layer/0.2mm
Surface treatment:Nickel Palladium Gold
Line width/line spacing:75um-25um
Applications:IC carrier board, IC substrate
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제품 세부 정보:

LGA package carrier board features

High Density Junction Structure

Via Fill Plating and Stacked Via Structures

Various surface treatments


High requirements for sheet and surface flatness


LGA package carrier board using process

Semi-additive method, laser drilling


LGA package carrier board application


Smartphones, Computers, IoT Products, Messaging Electronics


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